| Aluminum Nitride, AIN Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family. While its discovery occurred over 100 years ago, it has been developed into a commercially viable product with controlled and reproducible properties within the last 10 years. | .Key Properties |  | Good dielectric properties | | High thermal conductivity | | Low thermal expansion coefficient, close to that of Silicon | | Non-reactive with normal semiconductor process chemicals and gases | .
Typical Uses | | Substrates for electronic packages | | Heat sinks | | IC packages | | Power transistor bases | | Microwave device packages | | Material processing kiln furniture | | Semiconductor processing chamber fixtures and insulators | | Molten metal handling components | General Information
Aluminum nitride has a hexagonal crystal structure and is a covalent bonded material. The use of sintering aids and hot pressing is required to produce a dense technical grade material. The material is stable to very high temperatures in inert atmospheres. In air, surface oxidation occurs above 700°C. A layer of aluminum oxide forms which protects the material up to 1370°C. Above this temperature bulk oxidation occurs. Aluminum nitride is stable in hydrogen and carbon dioxide atmospheres up to 980°C. The material dissolves slowly in mineral acids through grain boundary attack, and in strong alkalis through attack on the aluminum nitride grains. The material hydrolyzes slowly in water. Most current applications are in the electronics area where heat removal is important. This material is of interest as a non-toxic alternative to beryllia. Metallization methods are available to allow AlN to be used in place of alumina and BeO for many electronic applications. Engineering Properties* | Aluminum Nitride | | Mechanical | Units of Measure | SI/Metric | (Imperial) | | Density | gm/cc (lb/ft3) | 3.26 | (203.5) | | Porosity | % (%) | 0 | (0) | | Color | — | gray | — | | Flexural Strength | MPa (lb/in2x103) | 320 | (46.4) | | Elastic Modulus | GPa (lb/in2x106) | 330 | (47.8) | | Shear Modulus | GPa (lb/in2x106) | — | — | | Bulk Modulus | GPa (lb/in2x106) | — | — | | Poisson’s Ratio | — | 0.24 | (0.24) | | Compressive Strength | MPa (lb/in2x103) | 2100 | (304.5) | | Hardness | Kg/mm2 | 1100 | — | | Fracture Toughness KIC | MPa•m1/2 | 2.6 | — | Maximum Use Temperature
(no load) | °C (°F) | — | — | | Thermal | | | | | Thermal Conductivity | W/m•°K (BTU•in/ft2•hr•°F) | 140–180 | (970–1250) | | Coefficient of Thermal Expansion | 10–6/°C (10–6/°F) | 4.5 | (2.5) | | Specific Heat | J/Kg•°K (Btu/lb•°F) | 740 | (0.18) | | Electrical | | | | | Dielectric Strength | ac-kv/mm (volts/mil) | 17 | (425) | | Dielectric Constant | @ 1 MHz | 9 | (9) | | Dissipation Factor | @ 1 MHz | 0.0003 | (0.0003) | | Loss Tangent | @ 1 MHz | — | — | | Volume Resistivity | ohm•cm | >1014 | — | *All properties are room temperature values except as noted.
The data presented is typical of commercially available material and is offered for comparative purposes only. The information is not to be interpreted as absolute material properties nor does it constitute a representation or warranty for which we assume legal liability. User shall determine suitability of the material for the intended use and assumes all risk and liability whatsoever in connection therewith. Back to top Standard Products | Custom Products and Services | Case Studies | Materials
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